Enhanced version with improved camera systems, thermal compensation, and higher bonding accuracy. 2200 evo hS: High-speed variant optimized for throughput. Datacon 2200 evo - Product details | Besi
: If your machine was produced before 2020, there is a separate existing catalog available in the same customer area [14]. Key Technical Specifications If you are looking for general operational information, the Datacon 2200 evo is known for these features: datacon 2200 evo manual pdf kenya
Understanding the machine's capabilities is vital for optimizing production lines in Kenya: Specification Details @ 3s (model dependent) Bond Force Programmable from 0.5N up to 500N (on the hF model) Throughput Up to 12,000 Units Per Hour (UPH) for the EVO hS model Wafer Sizes Handles 4" to 12" wafers (SEMI M1) Die Size Range 0.15 mm to 50 mm Dimensions 1,160 mm x 1,225 mm x 1,750 mm; Weight: ~1,300 kg Machine Highlights & Capabilities Key Technical Specifications If you are looking for